8’’ (200mm)

Process : 65~180nm
Offerings : eFlash, Power, DDI, CIS to RF/IoT, Fingerprint Sensor.

12’’ (300mm)

Process : 5~45nm
Offerings : HKMG (High-K Metal Gate),
FD-SOI (Fully Depleted-Silicon on Insulator),
FinFET, World 1st True EUV